A novel cumulative fatigue damage model for electronically-conductive adhesive joints under variable loading

Journal of Adhesion Science and Technology

Volumn 20, Issue 1, 2006, Pages 69-86

  Gomatam, Rajesh R ^a   Sancaktar, Erol ^b  

^a Lehigh University   (United States)

^b The University of Akron   (United States)

Author keywords

Adhesive joints, cumulative fatigue damage; Cyclic creep; Cyclic loading; Electronically conductive adhesives; Endurance limit; Fatigue life predictive model; Fracture; P N curve

Indexed keywords

CREEP; FATIGUE OF MATERIALS; FRACTURE; LOADS (FORCES); MATHEMATICAL MODELS; ADHESIVE JOINTS; CREEP TESTING; ELECTRIC CONDUCTIVITY; STRESS ANALYSIS;

ADHESIVE JOINTS, CUMULATIVE FATIGUE DAMAGE; CYCLIC CREEP; CYCLIC LOADING; ELECTRONICALLY CONDUCTIVE ADHESIVES; ENDURANCE LIMIT; FATIGUE LIFE PREDICTIVE MODEL; P-N CURVE;

ADHESIVE JOINTS; FATIGUE DAMAGE;

CUMULATIVE FATIGUE DAMAGE; CYCLIC CREEP; CYCLIC LOADINGS; ELECTRONICALLY CONDUCTIVE ADHESIVES; ENDURANCE LIMIT; P-N CURVE;

EID: 33645067640     PISSN: 01694243     EISSN: None     Source Type: Journal    
DOI: 10.1163/156856106775212404     Document Type: Article

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