Chemorheology of epoxy/nickel conductive adhesives during processing and cure

Journal of Adhesion Science and Technology

Volumn 22, Issue 8, 2008, Pages 957-981

  Zhou, Jianguo ^a   Sancaktar, Erol ^a  

^a University of Akron   (United States)

Author keywords

Chemorheological behavior; Chemoviscosity modeling; Epoxy Ni conductive adhesives; Steady shear

Indexed keywords

ADHESIVES; CURING; DRYING; ELECTRIC CONDUCTIVITY; INTEGRATED CIRCUITS; NICKEL; NON NEWTONIAN FLOW; PACKAGING MATERIALS; RESINS; SHEAR DEFORMATION; SHEAR FLOW; SHEARING MACHINES; TITRATION;

ARRHENIUS MODELS; CHEMORHEOLOGY; COMPREHENSIVE MODELING; CONDUCTIVE ADHESIVES; ELECTRICAL CONDUCTIVITY; EXPERIMENTAL DATA; FILLER VOLUME FRACTION; INDIVIDUAL MODELING; INTEGRATED CIRCUIT (IC) PACKAGING; LIU MODEL; LOWER COST; MODEL FIT; NON ISOTHERMAL; NON NEWTONIAN FLOWS; POWER LAW MODELS; SHEAR RATES; STEADY SHEAR; STRONGLY NONLINEAR;

VOLUME FRACTION;

EID: 46249091650     PISSN: 01694243     EISSN: 15685616     Source Type: Journal    
DOI: 10.1163/156856108X305453     Document Type: Article

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