The interrelationships between electronically conductive adhesive formulations, substrate and filler surface properties, and joint performance. Part II: The effects of bonding pressure

Journal of Adhesion Science and Technology

Volumn 18, Issue 11, 2004, Pages 1245-1261

  Gomatam, Rajesh R ^a   Sancaktar, Erol ^b  

^a Lehigh University   (United States)

^b The University of Akron   (United States)

Author keywords

Adhesive formulations; Adhesive thickness; Bonding pressure; Chemical etching; Conductive joint performance; Electronically conductive adhesives; Filler volume fraction; Nickel fillers; Substrate surface properties; Surface roughness

Indexed keywords

ADHESIVE JOINTS; BONDING; DEFORMATION; ELECTRIC CONDUCTIVITY; ETCHING; FILLERS; NICKEL; PARAMETER ESTIMATION; SURFACE ROUGHNESS; VOLUME FRACTION; ELECTRIC ARC WELDING; HYDROCHLORIC ACID; RESINS; SURFACE PROPERTIES;

ADHESIVE FORMULATIONS; ADHESIVE THICKNESS; BONDING PRESSURE; CHEMICAL ETCHING; CONDUCTIVE JOINT PERFORMANCE; ELECTRONICALLY CONDUCTIVE ADHESIVES; FILLER VOLUME FRACTION; NICKEL FILLERS; SUBSTRATE SURFACE PROPERTIES;

ADHESIVES; FILLERS;

ADHESIVE FORMULATION; ADHESIVE THICKNESS; BONDING PRESSURE; CHEMICAL ETCHING; ELECTRONICALLY CONDUCTIVE ADHESIVES; FILLER VOLUME FRACTION; JOINT PERFORMANCE; SUBSTRATE SURFACE PROPERTIES;

EID: 4544257812     PISSN: 01694243     EISSN: None     Source Type: Journal    
DOI: 10.1163/1568561041588228     Document Type: Article

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