The interrelationships between electronically conductive adhesive formulations, substrate and filler surface properties, and joint performance. Part I: The effects of adhesive thickness

Journal of Adhesion Science and Technology

Volumn 18, Issue 11, 2004, Pages 1225-1243

  Gomatam, Rajesh R ^a   Sancaktar, Erol ^b  

^a Lehigh University   (United States)

^b The University of Akron   (United States)

Author keywords

Adhesive formulations; Adhesive thickness; Bonding pressure; Chemical etching; Electronically conductive adhesives; Joint performance; Nickel fillers; Substrate surface properties; Surface roughness

Indexed keywords

ADHESIVE JOINTS; ELECTRIC CONDUCTIVITY; ETCHING; FILLERS; PROBLEM SOLVING; SURFACE ROUGHNESS; ELECTRIC ARC WELDING; SURFACE PROPERTIES;

ADHESIVE FORMULATIONS; ADHESIVE THICKNESS; BONDING PRESSURE; CHEMICAL ETCHING; ELECTRONICALLY CONDUCTIVE ADHESIVES; JOINT PERFORMANCE; NICKEL FILLERS; SUBSTRATE SURFACE PROPERTIES;

ADHESIVES; FILLERS;

ADHESIVE FORMULATION; ADHESIVE THICKNESS; BONDING PRESSURE; CHEMICAL ETCHING; ELECTRONICALLY CONDUCTIVE ADHESIVES; JOINT PERFORMANCE;

EID: 4544265790     PISSN: 01694243     EISSN: None     Source Type: Journal    
DOI: 10.1163/1568561041588219     Document Type: Article

References (49)

1. S. M. Darwish, A. Niazi, A. Ghania and M. E. Kassem, Int. J. Adhesion Adhesives 9, 224 (1989).
2. E. Sancaktar and N. Dilsiz, J. Adhesion Sci. Technol. 13, 679 (1999).
3. E. Sancaktar and Y. Wei, J. Adhesion Sci. Technol. 10, 1221 (1996).
4. J. H. Constable, T. Kache, H. Tiechmann, S. Muhle and M. A. Gaynes, in: Proceedings of the 3rd International Conference on Adhesive Joining and Coating Technology in Electronic Manufacturing, Binghamton, NY, p. 76 (1998).
5. D. R. Mulville and R. N. Vaishnev, J. Adhesion 7, 215 (1975).
6. E. Sancaktar and R. Gomatam, J. Adhesion Sci. Technol. 15, 97 (2001).
7. E. W. Garnish and G. C. Haskins, in: Aspects of Adhesion, D. J. Alner (Ed.), Vol. 5, p. 259. University of London Press, London (1969).
8. N. Chessin and V. Curran, J. Appl. Polym. Sci. (Appl. Polym. Symp.) 3, 319 (1966).
9. W. C. Wake, in: Adhesion: Fundamentals and Practice: A Report of an International Conference Held at the University of Nottingham, England, 1966, p. 115. Gordon and Breach, New York, NY (1969).
10. Y. Kobatake and Y. Inoue, Appl. Sci. Res. Ser. A 7, 53 (1958).
11. C. W. Jennings, in: Recent Advances in Adhesion, L. H. Lee (Ed.), p. 469. Gordon and Breach, New York, NY (1973).
12. A. F. Lewis and W. B. Ramsey, Adhesives Age 9 (2), 20 (1966).
13. R. F. Wegman and W. C. Tanner, ASTM Special Technical Publication 360, 163 (1963).
14. C. Keisler and J. L. Lataillade, J. Adhesion Sci. Technol. 9, 395 (1995).
15. E. Sancaktar, Y. Wei and M. A. Gaynes, J. Adhesion 56, 229 (1996).
16. K. Duan, X. Z. Hu and Y. W. Mai, J. Adhesion Sci. Technol. 18, 39 (2004).
17. S. K. Mazumdar and P. K. Mallick, Polym. Composit. 19, 139 (1998).
18. T. Sawa, J. Liu, K. Nakano and J. Tanaka, J. Adhesion Sci. Technol. 14, 43 (2000).
19. L. Higuchi, T. Sawa and H. Suga, J. Adhesion Sci. Technol. 16, 1585 (2002).
20. Y. Y. Lin, C. Y. Hui and Y. C. Wang, J. Polym. Sci. Part B Polym. Phys. 40, 2277 (2002).
21. M. Shahid and S. A. Hashim, J. Adhesion 73, 365 (2000).
22. G. Li, P. Lee-Sullivan and R. W. Thring, Composit. Struct. 46, 395 (1999).
23. E. Sancaktar and K. Narayan, J. Adhesion Sci. Technol. 13, 237 (1999).
24. T. Sawa, M. Aoki and O. Nishikawa, J. Adhesion 61, 55 (1997).
25. M. K. Apalak and R. Davies, Int. J. Adhesion Adhesives 13, 219 (1993).
26. J. K. Kim, H. S. Kim and D. G. Lee, J. Adhesion Sci. Technol. 17, 329 (2003).
27. K. C. Shin and J. J. Lee, J. Composite Mater. 37, 401 (2003).
28. L. Minnetyan and C. C. Chamis, Theor. Appl. Fract. Mech. 31, 75 (1999).
29. W. Li, L. Blunt and K. J. Stout, Int. J. Adhesion Adhesives 17, 303 (1997).
30. M. Belcher and G. Stewart, J. Dental Res. 77, 803 (1998).
31. L. Tong, Acta Mech. 117, 101 (1996).
32. K. E. Hokanson and A. Barcohen, IEEE Trans. Compon. Packag. Manuf. Technol., Part A 18, 578 (1995).
33. E. Sancaktar, J. Adhesion 40, 175 (1993).
34. E. D. Reedy and T. R. Guess, Int. J. Solids Struct. 30, 2929 (1993).
35. T. Yokoyama and Y. Sogabe, J. Phys. IV 10 (9), 167 (2000).
36. E. D. Reedy and T. R. Guess, Int. J. Fract. 88, 305 (1997).
37. T. Yokoyama, J. Strain Anal. Eng. Des. 38, 233 (2003).
38. T. Yokoyama, in: Key Engineering Materials, Vol. 145, Fracture and Strength of Solids, P. Tong, T. Y. Zhang and J. K. Kim (Eds), p. 317. Trans Tech Publications, Uetikon-Zurich (1998).
39. J. Tomblin, P. Harter and W. Seneviratne, J. Composite Technol. Res. 24, 80 (2002).
40. D. M. Gleich, M. L. J. Van Tooren and A. Beukers, Proc. 32nd International SAMPE Technical Conference, Vol. 32, p. 567 (2000).
41. O. Akinmade and J. W. Nicholson, Biomaterials 16, 149 (1995).
42. F. Kadioglu, A. Ozel, S. Sen and R. Sadeler, J. Adhesion 79, 683 (2003).
43. W. A. Zdaniewski, J. C. Conway and H. P. Kirchner, J. Am. Ceram. Soc. 70, 110 (1987).
44. D. M. Gleich, M. J. L. Van Tooren and A. Beukers, J. Adhesion Sci. Technol. 15, 1091 (2001).
45. Y. Wei and E. Sancaktar, J. Adhesion Sci. Technol. 10, 1199 (1996).
46. R. E. Bolz and G. L. Tuve (Eds), in: Handbook of Tables for Applied Engineering Science, 2nd edn, p. 131. CRC Press, Cleveland, OH (1976).
47. T. Hata, Org. Coating. Plastics Chem. 31, 193 (1971).
48. E. Sancaktar, A. Turgut and F. Guo, J. Adhesion 38, 89 (1992).
49. E. Sancaktar and P. Zhang, J. Mech. Design 112, 605 (1990).