Thickness-dependent conduction behavior of various particles for conductive adhesive applications

Journal of Adhesion Science and Technology

Volumn 13, Issue 7, 1999, Pages 763-771

  Sancaktar, Erol ^a   Dilsiz, Nursel ^b  

^a University of Akron   (United States)

^b ROKETSAN Missiles Industries Inc   (Turkey)

Author keywords

adhesive thickness; anisotropic electric conduction; conductive paths; contact resistance; electrical resistivity; Electronically conductive adhesives; nickel filaments; nickel flakes; nickel powder; silver coating; silver powder; thin film conduction

Indexed keywords

ADHESIVE THICKNESS; ANISOTROPIC ELECTRIC CONDUCTION; CONDUCTIVE PATHS; ELECTRICAL RESISTIVITY; ELECTRONICALLY CONDUCTIVE ADHESIVES; NICKEL FILAMENTS; NICKEL POWDER; SILVER COATING; SILVER POWDER;

COATINGS; CONDUCTIVE FILMS; CONTACT RESISTANCE; ELECTRIC CONDUCTIVITY; NICKEL; RESINS; SILVER PLATING; THIN FILMS; THREE DIMENSIONAL; CONDUCTIVE MATERIALS; ELECTRIC CONDUCTIVITY OF SOLIDS; ELECTRIC RESISTANCE; EPOXY RESINS; PARTICLES (PARTICULATE MATTER); SILVER;

SILVER; PLASTIC ADHESIVES;

CONTACT RESISTANCE; NICKEL FILAMENTS; NICKEL FLAKES;

EID: 0032689805     PISSN: 01694243     EISSN: 15685616     Source Type: Journal    
DOI: 10.1163/156856199X00992     Document Type: Article

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