Geometric effects on multilayer generic circuits fabricated using conductive epoxy/nickel adhesives

Journal of Adhesion Science and Technology

Volumn 22, Issue 8, 2008, Pages 947-956

  Zhou, Jianguo ^a   Sancaktar, Erol ^a  

^a University of Akron   (United States)

Author keywords

Electrical resistance; Epoxy Ni conductive adhesives; Generic circuits; Geometry; Multilayer hole structure

Indexed keywords

ADHESIVES; ELECTRIC CONDUCTIVITY; GEOMETRY; HEALTH; INTEGRATED CIRCUITS; MULTILAYERS; NETWORKS (CIRCUITS); OPTICAL DESIGN; PHOTOACOUSTIC EFFECT; REUSABILITY;

(CO/PT) MULTILAYERS; CIRCUIT BOARDS; ELECTRICAL CONDUCTIVITY; ELECTRICAL RESISTANCES; ELECTRONIC COMPONENTS; EMPIRICAL EQUATIONS; GENERIC CIRCUITS; GEOMETRIC EFFECTS; IN ORDER; INTEGRATED CIRCUIT (IC) PACKAGING; LOWER COST; MULTILAYER (ML); SOLUTION METHODS;

PACKAGING MATERIALS;

EID: 46249096353     PISSN: 01694243     EISSN: 15685616     Source Type: Journal    
DOI: 10.1163/156856108X305435     Document Type: Article

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