Conduction efficiency and strength of electronically conductive adhesive joints

Journal of Adhesion

Volumn 56, Issue 1-4, 1996, Pages 229-246

  Sancaktar, E ^a   Wei, Y ^a   Gaynes, M A ^b  

^a Clarkson University   (United States)

^b IBM   (United States)

Author keywords

Electric conduction; Electrically conductive adhesives; Interphase; Joint resistance; Joint strength; Oxides; Substrate plating; Surface topography

Indexed keywords

BOND STRENGTH (MATERIALS); CONDUCTIVE MATERIALS; ELECTRIC CONDUCTIVITY; INTERFACES (MATERIALS); MICROELECTRONIC PROCESSING; OXIDES;

ADHESIVE INTERCONNECTIONS; ELECTRICALLY CONDUCTIVE ADHESIVES; ENVIRONMENTAL STRESSING; OVERLAP JOINTS; SUBSTRATE PLATING; SURFACE TOPOGRAPHY;

ADHESIVE JOINTS;

EID: 0029712424     PISSN: 00218464     EISSN: None     Source Type: Journal    
DOI: 10.1080/00218469608010510     Document Type: Article

References (7)

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5. J. Honore, H. Rubin and M. Zierold, "Reliability Testing of Conductive Adhesives". Proceedings of the Technical Program, National Electronic Packaging and Production Conference, Vol. 3 (Cahner Exposition Group, Des Plains, I1., 1992) pp. 1372-1380.
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