Pressure-dependent conduction behavior of various particles for conductive adhesive applications

Journal of Adhesion Science and Technology

Volumn 13, Issue 6, 1999, Pages 679-693

  Sancaktar, Erol ^a   Dilsiz, Nursel ^b  

^a The University of Akron   (United States)

^b ROKETSAN Missiles Industries Inc   (Turkey)

Author keywords

conductive paths; constriction resistance; contact resistance; copper particles; electrical resistivity; Electronically conductive adhesives; interparticle conduction; magnetite spindles; nano particles; nickel filaments; nickel flakes; nickel particles; pressure dependent conduction; silver coating; silver powder; surface etching; tunnel resistance

Indexed keywords

CONDUCTIVE PATHS; CONSTRICTION RESISTANCE; COPPER PARTICLES; ELECTRICAL RESISTIVITY; ELECTRONICALLY CONDUCTIVE ADHESIVES; NICKEL FILAMENTS; NICKEL PARTICLES; SILVER COATING; SILVER POWDER; SURFACE ETCHING; TUNNEL RESISTANCE;

COATINGS; CONTACT RESISTANCE; COPPER; ELECTRIC CONDUCTIVITY; ETCHING; FILLERS; MAGNETITE; NICKEL; SILVER PLATING; SURFACE RESISTANCE; CONDUCTIVE MATERIALS; ELECTRIC CONDUCTIVITY MEASUREMENT; HYDROCHLORIC ACID; HYDROFLUORIC ACID; PARTICLES (PARTICULATE MATTER); PHOSPHORIC ACID; PRESSURE EFFECTS; SILVER;

SILVER; ADHESIVES;

FOUR-POINT PROBE METHOD; PARTICLE-FILLED CONDUCTIVE ADHESIVES;

EID: 0032631656     PISSN: 01694243     EISSN: 15685616     Source Type: Journal    
DOI: 10.1163/156856199X00938     Document Type: Article

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