The effects of filler volume fraction and film thickness on resistivity of conductive adhesives

Proceedings of the ASME Design Engineering Technical Conference

Volumn 3, Issue , 2003, Pages 957-974

  Sancaktar, Erol ^a   Bai, Lan ^a  

^a University of Akron   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONDUCTIVITY; ELECTRIC INSULATORS; ETCHING; FILLERS; INTERCONNECTION NETWORKS; LIQUID CRYSTAL DISPLAYS; MATRIX ALGEBRA; PARAMETER ESTIMATION; SEALING (CLOSING); VISCOSITY; VOLUME FRACTION; CHLORINE COMPOUNDS; ELECTRONICS PACKAGING; HYDROFLUORIC ACID; POWDER METALS; SURFACE TREATMENT;

CONDUCTIVE ADHESIVES; FILM THICKNESS; COMPONENT REPAIRS; CONDUCTIVE ADHESIVE; CONDUCTIVE FILLERS; DIE ATTACHMENT; DIFFERENT SIZES; ELECTRICAL CONDUCTION; ELECTRONIC PACKAGING APPLICATIONS; EPOXY-BASED; FILLER VOLUME FRACTION; FILM-THICKNESS;

ADHESIVES; FILM THICKNESS;

EID: 1842787564     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/detc2003/rsafp-48694     Document Type: Conference Paper

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