Dynamic fatigue and failure behavior of silver-filled electronically conductive adhesive joints at ambient environmental conditions

Journal of Adhesion Science and Technology

Volumn 18, Issue 7, 2004, Pages 731-750

  Gomatam, Rajesh R ^a   Sancaktar, Erol ^b  

^a Lehigh University   (United States)

^b The University of Akron   (United States)

Author keywords

Crack growth; Cyclic creep; Cyclic loading; Electronically conductive adhesives; Endurance limit; Fatigue; Fracture; Joint conductivity; Joint integrity; Mode I; Mode III; Rate effect; S N curve

Indexed keywords

CYCLIC LOADS; ELECTRONICS PACKAGING; FATIGUE OF MATERIALS; FRACTURE; LAPTOP COMPUTERS; STAINLESS STEEL; VIDEO CAMERAS; ADHESIVE JOINTS;

CYCLIC CREEP; ELECTRONICALLY CONDUCTIVE ADHESIVES; JOINT CONDUCTIVITY; RATE EFFECT;

ADHESIVE JOINTS; ELECTRIC CONDUCTIVITY;

CYCLIC FREQUENCY; DYNAMIC FATIGUE; ELECTRONICALLY CONDUCTIVE ADHESIVES; ENVIRONMENTAL CONDITIONS; FAILURE BEHAVIORS; FATIGUE BEHAVIOR; MONOTONIC AND CYCLIC LOADING; NONLINEAR BEHAVIOR; OPERATING CONDITION; PACKAGING APPLICATIONS; R VALUE; S-N CURVE;

EID: 3142741647     PISSN: 01694243     EISSN: None     Source Type: Journal    
DOI: 10.1163/156856104840291     Document Type: Article

References (12)

1. E. Sancaktar, in: Engineering Materials Handbook, Vol. 3, Adhesives and Sealants, H. F. Brinson (Technical Chairman), p. 501. ASM International, Materials Park, OH (1990).
2. N. N. S. Chen, P. I. F. Niem and R. C. Lee, J. Adhesion 21, 115 (1987).
3. R. D. Adams and W. C. Williams, Structural Adhesive Joints in Engineering. Elsevier Applied Science, New York, NY (1984).
4. A. J. Kinloch, Adhesion and Adhesives. Chapman and Hall, London (1987).
5. A. D. Crocombe and G. Richardson, Int. J. Adhesion Adhesives 19, 19 (1999).
6. J. A. Marceau, SAMPE J. 22, 64 (1977).
7. J. A. Harris and P. A. Fay, Int. J. Adhesion Adhesives 12, 9 (1992).
8. I. A. Ashcroft, M. M. Abdel Wahab, A.D. Crocombe, D. J. Hughes and S. J. Shaw, J. Adhesion 75, 61 (2001).
9. Z. Abdo and H. Aglan, J. Adhesion Sci. Technol. 7, 36 (1996).
10. E. Sancaktar and R. Gomatam, J Adhesion Sci. Technol. 15, 97 (2001).
11. R. R. Gomatam, Modeling fatigue behavior of electronically conductive adhesives, PhD Dissertation, The University of Akron, Akron, OH (2002).
12. T. Hata, Org. Coat. Plastics Chem. 31, 193 (1971).