Interfacial reactions of Pb-free solders with Au/Pd/Ni/brass multilayer substrates

Journal of Alloys and Compounds

Volumn 517, Issue , 2012, Pages 111-117

  Yen, Yee Wen ^a   Tsai, Po Hao ^a   Fang, Yang Kai ^a   Chen, Bo Jyun ^a   Lee, Chiapyng ^a  

^a NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

Au Pd Ni brass multilayer substrate; Interfacial reaction; Intermetallic compound; Lead free solder

Indexed keywords

INTERMETALLIC COMPOUND; LEAD FREE SOLDERS; MULTILAYER SUBSTRATE; PB FREE SOLDERS;

COPPER COMPOUNDS; INTERMETALLICS; LEAD; MULTILAYERS; PHASE INTERFACES; SOLDERING ALLOYS; SUBSTRATES; SURFACE CHEMISTRY; ZINC;

TIN;

EID: 84856232255     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2011.12.046     Document Type: Article

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