SCOPUS 정보 검색 플랫폼

Journal of Electronic Materials

Volumn 39, Issue 11, 2010, Pages 2412-2417

Interfacial reactions of Sn-58Bi and Sn-9Zn lead-free solders with Au/Ni/SUS304 multilayer substrate

(4) Yen, Yee Wen a Liaw, Da Wei a Chen, Kuen Da a Chen, Hao a

a NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY (Taiwan)

Author keywords

Au Ni SUS304 multilayer substrate; Diffusion controlled; Interfacial reaction; Sn 58Bi; Sn 9Zn

Indexed keywords

DIFFUSION CONTROLLED; INTERFACIAL REACTIONS; MULTILAYER SUBSTRATE; SN-58BI; SN-9ZN;

DIFFUSION; INTERMETALLICS; MULTILAYERS; PHASE INTERFACES; SOLDERING ALLOYS; SUBSTRATES; ZINC;

TIN;

EID: 78149285249 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-010-1336-8 Document Type: Article

Times cited : (15)

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