Effect of minor addition of Pb upon interfacial reactions and mechanical properties at Sn-3.0Ag-0.5Cu/Cu and Sn-58Bi/Cu solder joints

International Journal of Materials Research

Volumn 99, Issue 11, 2008, Pages 1256-1261

  Yen, Yee Wen ^a   Chou, Weng Ting ^a   Chen, Hong Chih ^a   Liou, Wei Kai ^a   Lee, Chiapyng ^a  

^a NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

Interfacial reaction; Intermetallic compound; Liquidus temperature; Mechanical strength; Pb free solder

Indexed keywords

BISMUTH COMPOUNDS; BRAZING; CONCENTRATION (PROCESS); COPPER; INTERMETALLICS; LEAD; LEAD ALLOYS; LEAD COMPOUNDS; MECHANICAL PROPERTIES; SEMICONDUCTING INTERMETALLICS; SILVER; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING ALLOYS; WELDING;

INTERFACIAL REACTION; INTERMETALLIC COMPOUND; LIQUIDUS TEMPERATURE; MECHANICAL STRENGTH; PB-FREE SOLDER;

TIN;

EID: 56149083593     PISSN: 18625282     EISSN: None     Source Type: Journal    
DOI: 10.3139/146.101760     Document Type: Article

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