Interfacial reactions between lead-free solders and the multilayer Au/Ni/SUS304 substrate

International Journal of Materials Research

Volumn 100, Issue 5, 2009, Pages 672-676

  Yen, Yee Wen ^a   Lee, Chun Yu ^a   Kuo, Meng Han ^a   Chao, Kuo Sing ^a   Chen, Kuen Da ^a  

^a NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

Diffusion controlled; Intermetallic compound; Reaction couple; Sn 3.0 wt. Ag 0.5 wt. Cu (SAC); Stainless steel

Indexed keywords

GROWTH OF INTERMETALLICS; INTERFACIAL REACTIONS; INTERMETALLIC COMPOUND; INTERMETALLIC COMPOUNDS; LEAD FREE SOLDERS; PARABOLIC LAW; REACTION COUPLE; REACTION TIME;

DIFFUSION; LEAD; PHASE INTERFACES; SEMICONDUCTING INTERMETALLICS; SILVER; SOLDERING ALLOYS; TIN;

STAINLESS STEEL;

EID: 77950788082     PISSN: 18625282     EISSN: None     Source Type: Journal    
DOI: 10.3139/146.110080     Document Type: Article

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