Abnormal spalling phenomena in the Sn-0.7Cu/Au/Ni/SUS304 interfacial reactions

Journal of Materials Research

Volumn 25, Issue 12, 2010, Pages 2278-2286

  Lin, Shih Kang ^a,c   Chen, Kuen Da ^a   Chen, Hao ^a   Liou, Wei Kai ^b   Yen, Yee Wen ^a  

^a NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

^b LUNGHWA UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

^c UNIVERSITY OF WISCONSIN MADISON   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

GROWTH MECHANISMS; INTERFACIAL REACTIONS; MOLTEN SOLDERS; PARABOLIC LAW; REACTION PHASE; REACTION TIME; TWO LAYERS;

ACTIVATION ENERGY; SPALLING; TIN;

PHASE INTERFACES;

EID: 78649497231     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2010.0305     Document Type: Article

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