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Journal of Electronic Materials

Volumn 40, Issue 2, 2011, Pages 213-223

Interdependent intermetallic compound growth in an electroless Ni-P/Sn-3.5Ag reaction couple

(2) Kumar, Aditya a Chen, Zhong a

a NANYANG TECHNOLOGICAL UNIVERSITY (Singapore)

Author keywords

Electroless Ni P; ENIG; interfacial reaction; intermetallic compound; kinetics; lead free solders; under bump metallization

Indexed keywords

ELECTROLESS NI-P; ENIG; INTERFACIAL REACTIONS; INTERMETALLIC COMPOUND; LEAD-FREE SOLDERS; UNDER BUMP METALLIZATION;

ACTIVATION ENERGY; GROWTH KINETICS; INTERMETALLICS; LEAD COMPOUNDS; METALLIZING; REACTION KINETICS; SOLDERING; TIN;

SOLDERING ALLOYS;

EID: 79951512545 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-010-1447-2 Document Type: Article

Times cited : (42)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.