Suppressing Ni3Sn4 formation in the Sn-Ag-Cu solder joints with Ni-P/Pd/Au surface finish

Materials Letters

Volumn 65, Issue 21-22, 2011, Pages 3216-3218

  Tseng, Chien Fu ^a   Lee, Tae Kyu ^b   Ramakrishna, Gnyaneshwar ^b   Liu, Kuo Chuan ^b   Duh, Jenq Gong ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b CISCO SYSTEMS   (United States)

Author keywords

ENEPIG; ENIG; Intermetallic alloys and compounds; Kirkendall voids; Lead free solder; Phase transformation

Indexed keywords

ENEPIG; ENIG; INTERMETALLIC ALLOYS AND COMPOUNDS; KIRKENDALL VOID; LEAD FREE SOLDERS; PHASE TRANSFORMATION;

INTERMETALLICS; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING ALLOYS;

TIN;

EID: 79960998226     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matlet.2011.07.015     Document Type: Article

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