Effect of Cu content on IMC between Sn-Cu solder and Cu and Ni substrates

Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals

Volumn 16, Issue 4, 2006, Pages 701-708

  He, Da Peng ^a   Yu, Da Quan ^a,b   Wang, Lai ^a   Wu, C M L ^b  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

^b CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Interfacial reaction; Intermetallic compound (IMC); Sn Cu solder; Soldering

Indexed keywords

COMPOSITION; COPPER; GROWTH (MATERIALS); INTERFACES (MATERIALS); MORPHOLOGY; NICKEL; SOLDERING; SUBSTRATES; TIN;

GROWTH MECHANISMS; INTERFACIAL REACTION; INTERMETALLIC COMPOUND (IMC); MASS FRACTION; TIN COPPER SOLDER;

INTERMETALLICS;

EID: 33745673596     PISSN: 10040609     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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