Improvement of drop reliability in OSP/Cu pad finished packages

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2006, Pages 168-173

  Kim, Pyoung Wan ^a   Kim, Bo Seong ^a   Ahn, Eun Chul ^a   Chung, Tae Gyeong ^a  

^a Hynix Semiconductor Inc   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING (DEFORMATION); BRAZING; COPPER; COPPER ALLOYS; DROPS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; ETCHING; FLUID MECHANICS; FRACTURE; FRACTURE FIXATION; NATURAL FREQUENCIES; NICKEL; TECHNOLOGY; TESTING; WELDING;

DROP TESTING; ETCHING DEPTH; FRACTURE MODES; INTERFACE FAILURE; OPTIMAL CONDITIONS; ORGANIC SOLDERABILITY PRESERVATIVES; PACKAGING TECHNOLOGIES; PEAK TEMPERATURES; RELIABILITY IMPROVEMENT; SOLDER BALLS; SOLDER COMPOSITION; TEST RESULTS;

SOLDERING;

EID: 35348912294     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2006.342710     Document Type: Conference Paper

References (8)

1. Yi-Shao Lai et al., "Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition", Microelectronics Reliability vol. 46, 2006, p.645-650.
2. H.T.Lee and Y.H. Lee, Materials Science and Engineering A, vol. 419, 2006, p. 172-180.
3. Masamoto Tanaka et al., "Improvement in Drop Shock Reliabiliy of Sn-1.2Ag-0.5Cu BGA Interconnects by Ni Addition", 2006 EPTC, p.78-84.
4. Ho Jeong Moon et al., "Brittle Fracture of Pb-free Solder Joint in Ni/Au finished FBGA MCP Mounted on OSP Board Subjected to Bening Impact Load", 2004 IMAPS.
5. JESD22-B111.
6. Jong-Woong Kim and Seung-Boo Jung, "Experimental and Finite Element Analysis of the Shear Speed Effects on the Sn-Ag and Sn-Ag-Cu BGA solder joints", Materials Science and Engineering A, vol. 371, 2004, p.267-276.
7. Li Li, Yang Rao and Jong Kai Lin, "Pb-free Solder Paste Reflow Window Study for Flip Chip Wafer Bumping", 2001 International Symposium on Advanced Packaging Mataials, p. 112-117.
8. S.K.Kang et al, "Progress in Pb-free Solders and Soldering Technology", IMAPS2004.