A comparative study of Sn3.5Ag and Sn3.8Ag0.7Cu for BGA spheres on Ni/Au finish

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 1819-1824

  Eu, Poh Leng ^a   Ding, Min ^a   Hoh, Huey Jiun ^a   Rayos, Joachim ^a   Su, Peng ^a   Lindsay, Wayne ^a   Chopin, Sheila ^a   Ahmad, Ibrahim ^b  

^a FREESCALE SEMICONDUCTOR INC   (United States)

^b UNIVERSITI KEBANGSAAN MALAYSIA   (Malaysia)

Author keywords

[No Author keywords available]

Indexed keywords

BRITTLENESS; ELECTRONICS PACKAGING; INTERMETALLICS; MICROSTRUCTURE; SOLDERED JOINTS; THERMAL CYCLING;

BOARD MOUNTING PROCESS; INTERMETALLIC BRITTLE FAILURE; PACKING DROP TESTS; SOLDER BALLS;

BALL GRID ARRAYS;

EID: 35348912448     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.374044     Document Type: Conference Paper

References (14)

1. Xiao, Q. et al, "Tensile Creep and Microstructural Characterization of Bulk Sn3.9AgO.6Cu Lead-Free Solder," J. Electron. Mater., Vol. 34, No. 2 (2005), pp. 196-211.
2. Pao, Y.H. et al, "Experimental and modeling study of thermal cyclic behavior of Sn-Cu and Sn-Pb solder joints", Mater. Res. Soc. Symp. Proc. Vol. 323, (1994), pp. 153-158.
3. Mavoori, H. et al, "Creep, stress relaxation, and plastic deformation in Sn-Ag and Sn-Zn eutectic solders," J. Electron. Mater., Vol. 26, No. 7, (1997), pp. 783-790.
4. th Electronic Components and Technology Conf, San Diego, CA, May. 2006, pp. 64-71.
5. th Electronic Components and Technology Conf, Orlando, FL, May. 2005, pp. 1194-1201.
6. Ho, C.E. et al, "Effect of Cu Concentration on the Reactions between Sn-Ag-Cu Solders and Ni," J. Electron. Mater., Vol. 31, No. 6, (2002), pp. 584-590.
7. Laurila, T. et al, "Analysis of the Redeposition of AuSn4 on Ni/Au Contact Pads when Using SnPbAg, SnAg, and SnAgCu Solders," J. Electron. Mater., Vol. 34, No. 1 (2005), pp. 103-111.
8. Amagai, M. et al, "Mechanical characterization of Sn-Ag based lead free solders," Microelectronic Reliability Vol. 42, (2002), pp.951-966
9. th Electronic Components and Technology Conf, Las Vegas, NV, May. 2004, pp. 675-682.
10. th Electronic Components and Technology Conf, New Orleams, LA, May. 2003, pp. 1203-1208.
11. th International Conference on Electronics Packaging Technology, (2005), pp.1564664.
12. Laurila, T. et al, "Interfacial reactions between lead-free solders and common base materials," Materials Science and Engineering, Vol. 49, (2005), pp.1-60.
13. th Electronic Packaging Technology Conference, (2005), pp.255-261.
14. th Electronic Packaging Technology Conference, (2005), pp.73-80.