Coffee stain ring effect and nonuniform material removal in chemical mechanical polishing

Journal of Tribology

Volumn 132, Issue 4, 2010, Pages

  Xin, Jianguo ^a  

^a UNIVERSITY OF NORTH CAROLINA AT CHARLOTTE   (United States)

Author keywords

chemical mechanical polishing; coffee stain ring effect; edge or doming effect; nonuniform material removal

Indexed keywords

ABRASIVE PARTICLES; BLANKET WAFERS; CMP PROCESS; DRYING DROPS; EDGE EFFECT; EDGE OR DOMING EFFECT; MATERIAL REMOVAL; METAL DISHING; MICROFLUIDIC FLOW; NONUNIFORM; NONUNIFORM MATERIAL REMOVAL; PATTERNED WAFERS; POLISHING PADS; RING EFFECT; SOLID RING; WAFER SURFACE;

CHEMICAL POLISHING; DROPS; EVAPORATION; MATERIALS; PHASE TRANSITIONS; POLISHING; SOLVENTS; STRIPPING (REMOVAL);

CHEMICAL MECHANICAL POLISHING;

EID: 79953237991     PISSN: 07424787     EISSN: 15288897     Source Type: Journal    
DOI: 10.1115/1.4002108     Document Type: Article

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