Chemical mechanical polishing with fixed abrasives using different subpads to optimize wafer uniformity

Microelectronic Engineering

Volumn 50, Issue 1-4, 2000, Pages 41-46

  Van Der Velden, P ^a  

^a PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

ABRASIVES; CHEMICAL POLISHING; FOAMED PLASTICS; OPTIMIZATION; POLYCARBONATES;

CHEMICAL MECHANICAL POLISHING (CMP); MICROREPLICATED RESIN;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0033640176     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(99)00262-2     Document Type: Article

References (1)

1. van der Velden P., Weimar F. Chemical mechanical polishing using fixed abrasives. Semicon Europa '98. 1998;5-9.