Chemical mechanical polishing of low-dielectric-constant polymers: hydrogen silsesquioxane and methyl silsesquioxane

Journal of the Electrochemical Society

Volumn 146, Issue 8, 1999, Pages 3004-3008

  Chen, Wen Chang ^a   Lin, Shu Chun ^a   Dai, Bau Tong ^b   Tsai, Ming Shih ^b  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^b NATIONAL NANO DEVICE LABORATORIES   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; CHEMICAL POLISHING; FOURIER TRANSFORM INFRARED SPECTROSCOPY; MORPHOLOGY; ORGANIC COMPOUNDS; PERMITTIVITY; POLYMERS; REFRACTIVE INDEX; STRUCTURE (COMPOSITION);

CHEMICAL MECHANICAL POLISHING; HYDROGEN SILSESQUIOXANE; LOW DIELECTRIC CONSTANT POLYMER; METHYL SILSESQUIOXANE;

ELECTROCHEMISTRY;

EID: 0032592416     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1392043     Document Type: Article

References (14)

1. P. Singer, Semicond. Int., 20(5), 88 (1996).
2. J. Wary, R. Olson, and W. Beach, Semicond. Int., 20(6), 211 (1996).
3. P. Singer, Semicond. Int., 21(5), 73 (1997).
4. P. Singer, Semicond. Int., 21(11), 69 (1997).
5. Mater. Res. Soc. Symp. Proc., 371 (1995).
6. Mater. Res. Proc. Symp. Proc., 443 (1996).
7. Mater. Res. Soc. Symp. Proc., 476 (1997).
8. J. M. Steigerwald, S. P. Murarka, and R. J. Gutmann, Chemical Mechanical Planarization of Microelectronic Materials, John Wiley & Sons, Inc., New York (1997).
9. M. J. Boboda and G. A. Toskey, Solid State Technol., 41, 99 (1998).
10. Y. L. Wang, C. Liu, S. T. Chang, M. S. Tsai, M. S. Feng, and W. T. Tseng, Thin Solid Films, 308, 550 (1997).
11. C.-W. Huang, M.S. Thesis, Institute of Materials Science and Engineering, National Chiao-Tung University, Hsinchu, Taiwan (1998).
12. N. P. Hacker, G. Davis, L. Figge, T. Krajewski, S. Lefferts, J. Nedbal, and R. Spear, Mater. Res. Soc. Symp. Proc., 476, 25 (1997).
13. M. Tomozawa, Solid State Technol., 40, 169 (1997).
14. G. A. Parks, Chem. Rev., 65, 177 (1965).