A study of a finite element model for the chemical mechanical polishing process

International Journal of Advanced Manufacturing Technology

Volumn 23, Issue 9-10, 2004, Pages 644-650

  Lin, Y Y ^a   Lo, S P ^a  

^a DE LIN INSTITUTE OF TECHNOLOGY   (Taiwan)

Author keywords

2D axisymmetric quasi static model; Carrier film; CMP; Finite element model; Pad; Wafer; Wafer carrier

Indexed keywords

COMPUTER SIMULATION; DEFORMATION; FINITE ELEMENT METHOD; LITHOGRAPHY; MATHEMATICAL MODELS; METALLIC FILMS; STRESS ANALYSIS; ULTRAVIOLET RADIATION; VACUUM;

2D AXISYMMETRIC QUASI-STATIC MODEL; CHEMICAL-MECHANICAL POLISHING PROCESS (CMP); CMP; FINITE ELEMENT MODEL; PAD; WAFER; WAFER CARRIER;

CHEMICAL MECHANICAL POLISHING;

EID: 2942687851     PISSN: 02683768     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00170-002-1469-x     Document Type: Article

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