Hydrodynamic characteristics of the thin fluid film in chemical-mechanical polishing

IEEE Transactions on Semiconductor Manufacturing

Volumn 15, Issue 1, 2002, Pages 39-44

  Chen, Jerry M ^a   Fang, Yuan Cheng ^a  

^a NATIONAL CHUNG HSING UNIVERSITY   (Taiwan)

Author keywords

CMP; Kinematics; Pressure distribution; Wafer pad interface

Indexed keywords

CHEMICAL MECHANICAL POLISHING; COMPUTER SIMULATION; DYNAMICS; HYDRODYNAMICS; KINEMATICS; MATHEMATICAL MODELS; NAVIER STOKES EQUATIONS;

WAFER CURVATURE;

THIN FILMS;

EID: 0036474675     PISSN: 08946507     EISSN: None     Source Type: Journal    
DOI: 10.1109/66.983442     Document Type: Article

References (11)

1. Chemical processes in glass polishing
2. Re-examination of pressure and speed dependences of removal rate during chemical-mechanical polishing processes
3. A model tool for chemical-mechanical polishing design and evaluation
4. Tribology analysis of chemical-mechanical polishing
5. Two-dimensional wafer-scale mechanical planarization model based on lubrication theory and mass transport
6. Pad porosity, compressibility and slurry delivery effects in chemical-mechanical planarization: Modeling and experiments