The relationship between wafer surface pressure and wafer backside loading in Chemical Mechanical Polishing

Thin Solid Films

Volumn 474, Issue 1-2, 2005, Pages 217-221

  Fu, Guanghui ^a,b   Chandra, Abhijit ^a  

^a IOWA STATE UNIVERSITY   (United States)

^b LAM RESEARCH CORPORATION   (United States)

Author keywords

Backside loading; Chemical Mechanical Polishing (CMP); Pressure distribution

Indexed keywords

COMPRESSIBILITY; COMPUTER SIMULATION; ELASTICITY; FINITE ELEMENT METHOD; PRESSURE DISTRIBUTION; SURFACE PROPERTIES;

BACKSIDE LOADING; CONTACT PRESSURE; MATERIAL REMOVAL; WAFER SURFACES;

CHEMICAL MECHANICAL POLISHING;

EID: 10844238794     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2004.09.010     Document Type: Article

References (17)

1. F.W. Preston, J. Soc. Glass Technol. 11 (1927) 214.
2. D.O. Ouma, Ph.D. thesis, Department of Electrical Engineering and Computer Science, MIT, USA, 1998.
3. S.R. Runnels, P. Renteln, Dielectr. Sci. Technol. (1993) 110.
4. A.R. Baker, Proceedings of Electrochemical Society Meeting, San Antonio, Texas, USA, October, 1996, p. 228.
5. D. Wang, J. Lee, K. Holland, T. Bibby, S. Beaudoin, T.S. Cale, J. Electrochem. Soc. 144 (1997) 1121.
6. C. Strinivasa-Murthy, D. Wang, S.P. Beaudoin, T. Bibby, K. Holland, T.S. Cale, Thin Solid Films 308-309 (1997) 533.
7. Y. Sasaki, H. Aoyama, I. Inasaki, H. Miyairi, H. Shibaya, Proceedings of Silicon Machining (1998 Spring Topical Meeting), Carmel-by-the-sea, CA, USA, April 13-16, 1998, p. 92.
8. G. Byrne, B. Mullany, P. Young, Ann. CIRP 48 (1999) 143.
9. W.-T. Tseng, Y.-H. Wang, J.-H. Chin, J. Electrochem. Soc. 146 (1999) 4273.
10. G. Fu, A. Chandra, J. Electron. Mater. 31 (2002) 1066.
11. G. Fu, A. Chandra, J. Electron. Mater. 30 (2001) 400.
12. K.L. Johnson, Contact Mechanics, Cambridge Univ. Press, Great Britain, 1985.
13. G.M.L. Gladwell, Contact Problems in the Classical Theory of Elasticity, Sijthoff and Noordhoof, Alphen aan den Rijn, The Netherlands, 1980.
14. S.P. Timoshenko, S. Woinowsky-Krieger, Theory of Plates and Shells, 2nd ed., McGraw-Hill, New York, USA, 1959.
15. G. Fu, A. Chandra, J. Appl. Mech., ASME 69 (2002) 142.
16. M.M. Zaman, M.O. Faruque, J. Eng. Mech. 117 (1991) 1775.
17. E.T. Calderon, W.S. Venturini, Proceedings of the 1997 19th International Conference on Boundary Element Methods, Rome, Italy, September 9-12, 1997, p. 245.