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Thin Solid Films

Volumn 414, Issue 1, 2002, Pages 78-90

Three-dimensional wafer-scale copper chemical-mechanical planarization model

(6) Thakurta, Dipto G a Gill, William N a Gutmann, Ronald J a Schwendeman, Donald W b Shankar, Sadasivan c Jiang, Lei c

a RENSSELAER POLYTECHNIC INSTITUTE (United States)

b Research Rensselaer Polytechnic Institute (United States)

c INTEL CORPORATION (United States)

Author keywords

Chemical mechanical planarization; Copper; Lubrication theory; Surface chemistry; Wafer scale

Indexed keywords

COPPER; HYDRODYNAMICS; LUBRICATION; MASS TRANSFER; REACTION KINETICS; SLURRIES; SURFACE CHEMISTRY;

CHEMICAL MECHANICAL PLANARIZATION;

SOLID STATE PHYSICS;

EID: 0036648063 PISSN: 00406090 EISSN: None Source Type: Journal
DOI: 10.1016/S0040-6090(02)00329-2 Document Type: Article

Times cited : (55)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.