Au-Sn flip-chip solder bump for microelectronic and optoelectronic applications

Microsystem Technologies

Volumn 13, Issue 11-12, 2007, Pages 1463-1469

  Yoon, Jeong Won ^a   Chun, Hyun Suk ^a   Koo, Ja Myeong ^a   Jung, Seung Boo ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

EUTECTICS; GOLD ALLOYS; MICROELECTRONICS; OPTOELECTRONIC DEVICES; SOLDERING; TIN ALLOYS;

EUTECTIC COMPOSITION; FLIP CHIP SOLDER BUMP; REFLOW TIME;

FLIP CHIP DEVICES;

EID: 34249782308     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-006-0330-9     Document Type: Conference Paper

References (8)

1. Djurfors B, Ivey DG (2001) Pulsed electrodeposition of the eutectic Au/Sn solder for optoelectronic packaging. J Electron Mater 30:1249-1254
2. Djurfors B, Ivey DG (2002) Microstructural characterization of pulsed electrodeposited Au/Sn alloy thin films. Mater Sci Eng B 90:309-320
3. Doesburg J, Ivey DG (2000) Microstructure and preferred orientation of Au-Sn alloy plated deposits. Mater Sci Eng B 78:44-52
4. Elger G, Hutter M, Oppermann H, Aschenbrenner R, Reichl H, Jager E (2002) Development of an assembly process and reliability investigations for flip-chip LEDs using AuSn soldering. Microsyst Technol 7:239-243
5. Kim DW, Lee CC (2006) Fluxless flip-chip Sn-Au solder interconnect on thin Si wafers and Cu laminated polyimide films. Mater Sci Eng A 416:74-79
6. 4 phase in Pb-free and Pb-containing solders on Ni/Au metallization. J Mater Res 18:2562-2570
7. Tew JWR, Shi XQ, Yuan S (2004) Au/Sn solder for face-down bonding of AlGaAs/GaAs ridge waveguide laser diodes. Mater Lett 58:2695-2699
8. Tsai JY, Chang CW, Shieh YC, Hu YC, Kao CR (2005) Controlling the microstructures from the gold-tin reaction. J Electron Mater 34:182-187