SCOPUS 정보 검색 플랫폼

Volumn 41, Issue 2, 2006, Pages 150-153

A new approach of creating Au-Sn solder bumps from electroplating

Author keywords

Au Sn; Bump; Electroplating; Flat chip

Indexed keywords

ELECTROPLATING; GOLD; METALLIZING; NICKEL; TIN; WETTING;

AU-SN; BUMP; FLAT-CHIP;

SOLDERING ALLOYS;

EID: 32644453422 PISSN: 02321300 EISSN: None Source Type: Journal
DOI: 10.1002/crat.200510547 Document Type: Article

Times cited : (15)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.