Thermal transient characteristics of die attach in high power LED PKG

Microelectronics Reliability

Volumn 48, Issue 3, 2008, Pages 445-454

  Kim, Hyun Ho ^a   Choi, Sang Hyun ^a   Shin, Sang Hyun ^a   Lee, Young Ki ^a   Choi, Seok Moon ^a   Yi, Sung ^a  

^a Samsung Electro Mechanics   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

EUTECTICS; FAILURE ANALYSIS; HEAT LOSSES; HEAT RESISTANCE; THERMODYNAMIC PROPERTIES; TRANSIENTS;

CROSS SECTION ANALYSIS; DIE ATTACH; EUTECTIC BONDING; SHEAR TEST;

LIGHT EMITTING DIODES;

EID: 39449138152     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2007.08.009     Document Type: Article

References (7)

1. Siegal B.S. Measuring thermal resistance is the key to a cool semiconductor. Electronics 51 (1978) 121-126
2. Rencz Marta. Thermal issues in stacked die packages. In: 21st IEEE SEMI-THERM Symposium '05, San Jose, CA, USA; March 15-17, 2005.
3. Rencz M, Szekely V. Die attach quality control of 3D stacked dies. In: Proceeding of the IEMT symposium of SEMICON west, San Jose, July 12-16, CA, USA, Proceedings; 2004. p. 78-84.
4. Rencz M, Szekely V. Structure function evaluation of stacked dies. In: Proceedings of the IEEE SEMI THERM symposium, March 9-11, San Jose, CA, USA; 2004. p. 50-5.
5. Nishiguchi M. Highly reliable Au-Sn eutectic bonding with background GaAs LSI chips. IEEE Trans Compon Hybr Manuf Technol 14 3 (1991)
6. Szekely V. A new evaluation method of thermal transient measurement results. Microelectron J 28 3 (1997) 277-292 [special issue of the THERMINIC workshop]
7. Sofia W. Analysis of thermal transient data with synthesized dynamic models for semiconductor devices. IEEE Trans Compon Pack Manuf 18 1 (1995) 39-47