SCOPUS 정보 검색 플랫폼

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 129-133

Gold-tin solder electroplating of photo-resist laminated AlN ceramics

(3) Akhlaghi, Siamak a Broughton, James N b Ivey, Douglas G b

a Micralyne Inc (Canada)

b UNIVERSITY OF ALBERTA (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; ELECTROPLATING; EUTECTICS; FATIGUE OF MATERIALS; GOLD ALLOYS; HEAT RESISTANCE; LAMINATES; METALLIZING; OPTOELECTRONIC DEVICES; PHOTORESISTS; SOLDERING ALLOYS;

SOLDER ELECTROPLATING;

ELECTRONICS PACKAGING;

EID: 0036290546 PISSN: 05695503 EISSN: None Source Type: Journal
DOI: 10.1109/ECTC.2002.1008085 Document Type: Article

Times cited : (1)

References (10)

1
- 0032146217
- Microstructural characterization of Au/Sn solder for packaging in optoelectronic applications
- (1998) Micron , vol.29 , Issue.4 , pp. 281-287
- Ivey, D.G.¹

2
- 0031140509
- Controlled solder interdiffusion for high power semiconductor laser die bonding
- (1997) IEEE Transactions on Components, Packaging and Manufacturing Technology - Part B , vol.20 , Issue.2 , pp. 141-145
- Merritt, S.A.¹ Heim, P.J.S.² Cho, S.H.³ Dagenais, M.⁴

3
- 0006676792
- Electrodeposition, growth morphology and melting characteristics of gold-tin eutectic alloys
- (1988) Plating and Surface Finishing , vol.85 , Issue.4 , pp. 66-73
- Holbrom, G.¹ Abys, J.A.² Straschil, H.K.³ Svensson, M.⁴

4
- 0028433545
- Advanced metallization schemes for bonding of InP-based laser devices to CVD-diamond heatsinks
- (1994) Materials Chemistry and Physics , vol.37 , Issue.4 , pp. 303-328
- Katz, A.¹ Lee, C.H.² Tai, K.L.³

5
- 0033570521
- Development of an electroplating solution for codepositing Au-Sn alloys
- (1999) Materials Science and Engineering B , vol.65 , Issue.2 , pp. 111-122
- Sun, W.¹ Ivey, D.G.²

6
- 0034825214
- Microstructural study of co-electroplated Au/Sn alloys
- (2001) Journal of Materials Science , vol.36 , pp. 757-766
- Sun, W.¹ Ivey, D.G.²

7
- 0027543054
- Au-Sn alloy phase diagram and properties related to its use as a bonding medium
- (1993) Thin Solid Films , vol.223 , pp. 276-287
- Matijasevic, G.S.¹ Lee, C.C.² Wang, C.Y.³

8
- 0034292509
- Microstructure and preferred orientation of Au-Sn alloy plated deposits
- (2000) Materials Science and Engineering B (Switzerland) , vol.B78 , Issue.1 , pp. 44-52
- Doesberg, J.¹ Ivey, D.G.²

9
- 0001779186
- Co-deposition of gold-tin alloys from a non-cyanide solution
- (2001) Plating and Surface Finishing , vol.88 , pp. 78-83
- Doesberg, J.¹ Ivey, D.G.²

10
- 0035454944
- Pulsed electrodeposition of the eutectic Au/Sn solder for optoelectronic packaging
- (2001) Journal of Electronic Materials , vol.30 , pp. 1249-1254
- Djurfors, B.¹ Ivey, D.G.²

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.