Calculation of shape and experimental creation of AuSn solder bumps for flip chip applications

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 282-288

  Hutter, M ^a   Oppermann, H ^a   Engelmann, G ^a   Wolf, J ^a   Ehrmann, O ^a   Aschenbrenner, R ^a   Reichl, H ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROPLATING; EUTECTICS; GOLD; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; SOLDERING; STRESSES; THERMAL CYCLING; TIN;

SOLDER BUMPS;

FLIP CHIP DEVICES;

EID: 0036287393     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: 10.1109/ECTC.2002.1008108     Document Type: Article

References (11)

1. Gold and gold-tin wafer bumping by electrochemical deposition for flip chip and TAB
2. Development of a fine pitch bumping process
3. Fluxless flip-chip soldering using the eutectic gold-tin system - A comparison between self-alignment and thermode bonding
4. Self-aligning flip-chip assembly using eutectic gold/tin solder in different atmospheres
5. Fluxless flip-chip attachment techniques using the AU/SN metallurgy
6. Experimental results on the self-alignment process using Au/Sn meatallurgy and on the growth of the ζ-Pase during the reflow
7. Reliability invesitigations for flip-chip on flex using different solder materials
8. Investigations of self-alignment during flip-chip assembly using eutectic gold-tin metallurgy
9. The Au-Sn(Gold-Tin) system
10. Interdiffusion and phase formation at room temperature in evaporated gold-tin films
11. Room temperature interdiffusion studies of Au/Sn thin film couples