Improvements in the process for electrodeposition of Au-Sn alloys

2006 International Conference on Compound Semiconductor Manufacturing Technology

Volumn , Issue , 2006, Pages 201-204

  Morawej, Nasim ^a   Ivey, Douglas G ^a   Akhlaghi, Siamak ^b  

^a UNIVERSITY OF ALBERTA   (Canada)

^b Micralyne Inc   (Canada)

Author keywords

Electrodeposition; Electroplating bath stability; Eutectic solders; Gold; Tin

Indexed keywords

COMMERCIAL EXPLOITATION; COMMERCIAL SOFTWARE; ELECTROPLATING BATH; ELECTROPLATING PROCESS; EUTECTIC SOLDERS; OPTIMAL COMBINATION; SEMICONDUCTOR SUBSTRATE; SOLUTION COMPONENTS;

CERIUM ALLOYS; ELECTRODEPOSITION; ELECTROPLATING; GOLD; OPTIMIZATION; SEMICONDUCTOR DEVICE MANUFACTURE; TIN;

GOLD DEPOSITS;

EID: 84876921141     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. A. He, B. Djurfors, S. Akhlaghi and D.G. Ivey, 2002, "Pulse Plating of Gold-Tin Alloys for Microelectronic and Optoelectronic Applications", Plating and Surface Finishing, Vol. 89, 48-53.
2. A. He, Q. Liu and D.G. Ivey, 2005, "Investigation on the Stability of a Au-Sn Electroplating Solution", Plating and Surface Finishing, Vol. 92, 30-36.
3. NIST/SEMATECH e-Handbook of Statistical Methods, http://www.itl.nist.gov/ div898/handbook/Jan 2006.