Interfacial metallurgical reaction between small flip-chip Sn/Au bumps and thin Au/TiW metallization under multiple reflow

Scripta Materialia

Volumn 58, Issue 7, 2008, Pages 606-609

  Yu, D Q ^a   Oppermann, H ^a   Kleff, J ^a   Hutter, M ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

AuSn; Flip chip; Intermetallic compounds; Soldering; Wetting

Indexed keywords

FLIP CHIP DEVICES; INTERMETALLICS; METALLIZING; SOLDERING; WETTING;

DEWETTING; MULTIPLE REFLOW; VOIDS;

SURFACE CHEMISTRY;

EID: 38749093333     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2007.11.020     Document Type: Article

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