Kinetics of reactive diffusion between Au and Sn during annealing at solid-state temperatures

Materials Science and Engineering: A

Volumn 390, Issue 1-2, 2005, Pages 118-126

  Yamada, T ^a   Miura, K ^a   Kajihara, M ^a   Kurokawa, N ^b   Sakamoto, K ^b  

^a TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

^b Tyco Electronics AMP Co Ltd   (Japan)

Author keywords

Bulk diffusion; Diffusion bonding; EPMA; Intermetallic compounds; Solder

Indexed keywords

ANNEALING; BONDING; GOLD; GRAIN BOUNDARIES; GRAIN GROWTH; INTERFACES (MATERIALS); RATE CONSTANTS; THERMAL EFFECTS; TIN;

ANNEALING TEMPERATURE; DIFFUSION BONDING; RATE-CONTROLLING PROCESS; SOLID-STATE TEMPERATURES;

DIFFUSION;

ANNEALING; KINETICS;

EID: 10944244655     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2004.08.053     Document Type: Article

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