Reliability investigations of fluxless flip-chip interconnections on green tape ceramic substrates

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 19, Issue 1, 1996, Pages 24-32

  Kloeser, Joachim ^a,b   Zakel, Elke ^a,b   Bechtold, Franz ^c   Reichl, Herbert ^d  

^a IEEE

^b FRAUNHOFER IZM   (Germany)

^c Siegert GmbH   (Germany)

^d TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

Au Sn solder bumps; Electrical and mechanical tests; Fluxless flip chip assembly; Reliability investigations; Thick film metallization; Underfill

Indexed keywords

BONDING; CERAMIC MATERIALS; ENCAPSULATION; FATIGUE OF MATERIALS; MECHANICAL TESTING; METALLIZING; RELIABILITY; SUBSTRATES; THERMAL CYCLING; THERMAL EFFECTS; THERMAL EXPANSION; THICK FILMS;

ELECTRICAL TESTING; FLUXLESS FLIP CHIP INTERCONNECTIONS; GREEN TAPE CERAMIC SUBSTRATES; SOLDER BUMPS;

FLIP CHIP DEVICES;

EID: 0030104263     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.486558     Document Type: Article

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