Modified face-down bonding of ridge-waveguide lasers using hard solder

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 31, Issue 2, 2008, Pages 159-167

  Teo, J W R ^a   Shi, X Q ^a,b   Yuan, S ^a   Li, G Y ^a   Wang, Z F ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

Face down bonding configuration; Laser diode (LD); Microassembly; Optimal bonding window; Reliability testing; Solder preform

Indexed keywords

BONDING; INTERMETALLICS; METALLOGRAPHY; MICROSTRUCTURAL EVOLUTION; SOLDERING ALLOYS; SURFACE TENSION; TEMPERATURE CONTROL; WAVEGUIDES;

FACE-DOWN BONDING; OPTICAL BONDING WINDOW; RIDGE-WAVEGUIDE LASERS;

SEMICONDUCTOR LASERS;

EID: 42549141550     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2008.919329     Document Type: Article

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