Mounting of high power laser diodes on boron nitride heat sinks using an optimized Au/Sn metallurgy

IEEE Transactions on Advanced Packaging

Volumn 24, Issue 4, 2001, Pages 434-441

  Pittroff, Wolfgang ^a,b   Erbert, Goetz ^a,b   Beister, Gert ^b   Bugge, Frank ^b   Klein, Achim ^b   Knauer, Arne ^b   Maege, Juergen ^b   Ressel, Peter ^b   Sebastian, Juergen ^b   Staske, Ralf ^b   Traenkle, Guenther ^b  

^a IEEE   (Germany)

^b LEIBNIZ INSTITUT FÜR HÖCHSTFREQUENZTECHNIK   (Germany)

Author keywords

Gold tin solder; Heat dissipation; Laser diodes; Soldering; Stress control

Indexed keywords

EUTECTIC SOLDER; SOLDER METALLURGY; STRESS CONTROL; STRESS INDUCED LASER;

CUBIC BORON NITRIDE; EUTECTICS; GOLD METALLURGY; HEAT LOSSES; HEAT SINKS; LIGHT EMISSION; LIGHT MEASUREMENT; LIGHT POLARIZATION; METALLIZING; SOLDERING; THERMODYNAMIC STABILITY; TIN METALLURGY;

SEMICONDUCTOR LASERS;

EID: 0035521195     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.982826     Document Type: Article

References (12)

1. A new bonding technology using gold and tin multilayer composite structures
2. Void-free Au-Sn eutectic bonding of GaAs dice and its characterization using scanning acoustic microscopy
3. Void free bonding of large silicon dice using gold-tin alloys
4. Mounting of high power laser diodes on diamond heat sinks
5. Experimental results on the self-alignment process using Au/Sn metallurgy and on the growth of the ζ-phase during the reflow
6. Performance of 3W-100μm stripe diode lasers at 950 and 810 nm
7. A critical review of VLSI die attachment in high reliability application
8. Highly reliable tensity strained 810 nm QW laserdiode operating at high temperatures
9. Imaging of stresses in GaAs diode lasers using polarization-resolved photoluminescence
10. Polarization of the spontaneous radiation of stressed laser heterostructures
11. Al-free 950 nm BA lasers with high efficiency and reliability at 50°C ambient temperature