Pulse plating of gold-tin alloys for microelectronic & optoelectronic applications

Plating and Surface Finishing

Volumn 89, Issue 11, 2002, Pages 48-53

  He, Anqiang ^a   Djurfors, Barbara ^c   Akhlaghi, Siamak ^b   Ivey, Douglas G ^a  

^a UNIVERSITY OF ALBERTA   (Canada)

^b Micralyne Inc   (Canada)

^c NONE

Author keywords

[No Author keywords available]

Indexed keywords

COST EFFECTIVENESS; CURRENT DENSITY; ELECTRONICS PACKAGING; ELECTROPLATING; EUTECTICS; GOLD ALLOYS; MICROELECTRONICS; OPTOELECTRONIC DEVICES; PHASE DIAGRAMS; SEMICONDUCTOR MATERIALS; THERMAL EFFECTS; TIN;

PULSED CURRENTS;

SOLDERING ALLOYS;

EID: 0036870892     PISSN: 03603164     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (13)

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