Fluxless silicon-to-alumina bonding using electroplated Au-Sn-Au structure at eutectic composition

Materials Science and Engineering: A

Volumn 458, Issue 1-2, 2007, Pages 101-107

  Kim, Jong S ^a   Choi, Won S ^a   Kim, Dongwook ^a   Shkel, Andrei ^b   Lee, Chin C ^a  

^a University of California at Irvine   (United States)

^b UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

Electroplating; Eutectic Au Sn alloys; Fluxless bonding; Fluxless soldering; Soldering

Indexed keywords

ALUMINA; CREEP RESISTANCE; ELECTROPLATING; EUTECTICS; FATIGUE OF MATERIALS; METALLOGRAPHIC MICROSTRUCTURE; OXIDATION RESISTANCE; SILICON; SOLDERING ALLOYS; STRUCTURE (COMPOSITION); THERMAL EXPANSION;

FLUXLESS BONDING; FLUXLESS SOLDERING; SILICON CHIPS;

SOLDERING;

ALUMINA; CREEP RESISTANCE; ELECTROPLATING; EUTECTICS; FATIGUE OF MATERIALS; METALLOGRAPHIC MICROSTRUCTURE; OXIDATION RESISTANCE; SILICON; SOLDERING; SOLDERING ALLOYS; STRUCTURE (COMPOSITION); THERMAL EXPANSION;

EID: 34147096895     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2006.12.106     Document Type: Article

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