Robust hard-solder packaging of conduction cooled laser diode bars

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6456, Issue , 2007, Pages

  Schleuning, David ^a   Griffin, Mike ^a   James, Phillip ^a   McNulty, John ^a   Mendoza, Dan ^a   Morales, John ^a   Nabors, David ^a   Peters, Mike ^a   Zhou, Hailong ^a   Reed, Murray ^a  

^a Research and Development Department   (United States)

Author keywords

Gold tin solder; High power laser diode; Reliability

Indexed keywords

GOLD-TIN SOLDER; HIGH POWER LASER DIODE; LIFE-TEST DATA;

COMPUTER SIMULATION; FINITE ELEMENT METHOD; LASER PULSES; SEMICONDUCTOR LASERS; SOLDERING ALLOYS;

ELECTRONICS PACKAGING;

EID: 34247543899     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.701292     Document Type: Conference Paper

References (9)

1. X. Liu, et al. "A study on the reliability of indium solder die bonding of high power semiconductor lasers", Journal of Applied Physics, 99, 1, 2006.
2. D. Lorenzen, M. Schroder, J. Meusel, P. Hennig, H. Konig, M. Philippens, J. Sebastian, and R. Hulsewede, "Comparative performance studies of indium and gold-tin packaged diode laser bars, High-Power Diode Laser Technology and Applications IV. Proc. of SPIE 610404-1, 2006.
3. G. Klumel, et al. "Reliable high power diode lasers: thermo-mechanical fatigue aspects", High-Power Diode Laser Technology and Applications IV, Proc. of SPIE 610402-1, 2006.
4. M. Mondry, M. Fouksman, H. Zhou, J. Li, and J Haapamaa, "High power, reliable 808nm laser bars for QCW and CW applications", High-Power Diode Laser Technology and Applications IV, Proc. of SPIE 610408-1, 2006.
5. H. Zhou, K. Kennedy, E. Weiss, J. Li, S. Anikitchev, P. Reichert, J. Du, D. Schleuning, D. Nabors, and M. Reed, "High-efficiency and high-reliability 9xx bars and fiber-coupled devices at Coherent", High-Power Diode Laser Technology and Applications IV. Proc. of SPIE 610406-1, 2006.
6. W. Koechner, "Solid-State Laser Engineering", Springer-Verlag.
7. Biermann et al., J. of Applied Phys, Vol 96, No8, 2004 "Spectroscopic method of strain analysis in semiconductor quantum-well devices"
8. M. Ohring, M. "Reliability and Failure of Electronic Materials and Devices", Academic Press.
9. J. Tomm et al. "Diode laser testing by taking advantage of its photoelectric properties", Proc. of SPIE Vol 4648, 2002.