A study of SnAgNiCo vs Sn3.8AgO.7Cu C5 lead free solder alloy on mechanical strength of BGA solder joint

10th Electronics Packaging Technology Conference, EPTC 2008

Volumn , Issue , 2008, Pages 588-594

  Leng, Eu Poh ^a   Ding, Min ^a   Ling, Wong Tzu ^a,b   Amin, Nowshad ^b   Ahmad, Ibrahim ^b   Lee, Mok Yong ^c   Haseeb, A S M A ^c  

^a FREESCALE SEMICONDUCTOR INC   (United States)

^b UNIVERSITI KEBANGSAAN MALAYSIA   (Malaysia)

^c University Malaya Malaysia   (Malaysia)

Author keywords

BGA packaging; Brittle solder joint; Intermetallic; Lead free C5; Pull strength; Shear; Sn3.8AgO.7Cu; SnAgNiCo

Indexed keywords

BGA PACKAGING; BRITTLE SOLDER JOINT; LEAD-FREE C5; PULL STRENGTH; SHEAR; SN3.8AGO.7CU; SNAGNICO;

ALLOYS; AUTOMOBILE ELECTRONIC EQUIPMENT; BRAZING; COPPER ALLOYS; DIFFERENTIAL SCANNING CALORIMETRY; DISPERSION HARDENING; DROPS; ELECTRIC BATTERIES; ELECTRIC CURRENTS; ELECTRONICS PACKAGING; EUROPIUM; EUTECTICS; GRAIN GROWTH; HIGH TEMPERATURE SUPERCONDUCTORS; LEAD ALLOYS; MECHANICAL PROPERTIES; MELTING POINT; MICROELECTRONICS; MICROSTRUCTURE; NICKEL; SEMICONDUCTING INTERMETALLICS; SHEAR STRENGTH; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; SPHERES; THERMAL AGING; THERMAL EFFECTS; TIN; TIN ALLOYS; WELDING; ZINC;

LEAD;

EID: 63049137281     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2008.4763497     Document Type: Conference Paper

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