Morphology and pull strength of Sn-Ag(-Co) solder joint with copper pad

Journal of Electronic Materials

Volumn 36, Issue 9, 2007, Pages 1137-1143

  Nishikawa, Hiroshi ^a   Komatsu, Akira ^b   Takemoto, Tadashi ^a  

^a OSAKA UNIVERSITY   (Japan)

^b OSAKA UNIVERSITY   (Japan)

Author keywords

Co addition; Intermetallic compound (IMC); Joint strength; Lead free solder; Minor element; Pull test

Indexed keywords

JOINT STRENGTH; LEAD-FREE SOLDERS; MINOR ELEMENTS; PULL TESTS;

INTERMETALLICS; STRENGTH OF MATERIALS; SURFACE CHEMISTRY; SURFACE MORPHOLOGY; TIN;

SOLDERED JOINTS;

EID: 34548224256     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-007-0148-y     Document Type: Article

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