Progress in representation and validation of physics-based via models

Proceedings - 11th IEEE Workshop on Signal Propagation on Interconnects, SPI 2007

Volumn , Issue , 2007, Pages 145-148

  Schuster, Christian ^a   Selli, Giuseppe ^b   Kwark, Young H ^c   Ritter, Mark B ^c   Drewniak, James L ^b  

^a HAMBURG UNIVERSITY OF TECHNOLOGY   (Germany)

^b MISSOURI UNIVERSITY OF SCIENCE AND TECHNOLOGY   (United States)

^c IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP PACKAGES; EQUIVALENT CIRCUIT MODEL; EXPERIMENTAL DATA; GEOMETRICAL STRUCTURE; GOOD CORRELATIONS; HIGH-SPEED COMMUNICATION SYSTEMS; MULTILAYER CONFIGURATION; PHYSICS-BASED; POWER INTEGRITY; VECTOR NETWORK ANALYZERS;

COMMUNICATION SYSTEMS; DATA FLOW ANALYSIS; ELECTRIC NETWORK ANALYSIS; ELECTRIC NETWORK ANALYZERS; INTERCHANGES; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; TECHNICAL PRESENTATIONS;

MODELS;

EID: 69249234618     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SPI.2007.4512234     Document Type: Conference Paper

References (10)

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