Finite-difference modeling of noise coupling between power/ground planes in multilayered packages and boards

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 1262-1267

  Ege Engin, A ^a   Bharath, Krishna ^a   Swaminathan, Madhavan ^a   Cases, Moises ^b   Mutnury, Bhyrav ^b   Pham, Nam ^b   De Araujo, Daniel N ^b   Matoglu, Erdem ^b  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COST EFFECTIVENESS; FINITE DIFFERENCE METHOD; MULTILAYERS; SIGNAL INTERFERENCE;

MULTILAYER FINITE-DIFFERENCE METHOD (M-FDM); MULTILAYERED PACKAGES; NOISE COUPLING MECHANISMS; SIGNAL INTEGRITY;

ELECTRONICS PACKAGING;

EID: 33845563686     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645815     Document Type: Conference Paper

References (8)

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