Simulation of via interconnects using physics-based models and microwave network parameters

12th IEEE Workshop on Signal Propagation on Interconnects, SPI

Volumn , Issue , 2008, Pages

  Rimolo Donadio, Renato ^a   Stepan, Andrzej J ^a   Brüns, Heinz Dietrich ^a   Drewniak, James L ^b   Schuster, Christian ^a  

^a HAMBURG UNIVERSITY OF TECHNOLOGY   (Germany)

^b MISSOURI UNIVERSITY OF SCIENCE AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CIRCUIT THEORY; CRACK PROPAGATION; ELECTRIC FIELDS; ELECTROMAGNETIC FIELD THEORY; ELECTROMAGNETIC FIELDS; ELECTROMAGNETISM; ELECTRONIC EQUIPMENT MANUFACTURE; INFORMATION THEORY; INTERCHANGES; MAGNETIC FIELDS; MICROWAVES; OPTIMIZATION; POLYCHLORINATED BIPHENYLS; PRINTED CIRCUIT MANUFACTURE; PRINTED CIRCUITS; THREE DIMENSIONAL;

ACCURATE MODELING; ARBITRARY NUMBERS; DESIGN OPTIMIZATION; FIELD SIMULATIONS; MULTI-LAYERED; NETWORK PARAMETERS; NETWORK THEORY; PARTIAL RESULTS; PHYSICS-BASED MODELLING; PROMISING TECHNIQUE; S-PARAMETERS; SEGMENTATION METHODS; SIGNAL PROPAGATION; SYSTEM-LEVEL SIMULATIONS;

PRINTED CIRCUIT BOARDS;

EID: 51849150952     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SPI.2008.4558352     Document Type: Conference Paper

References (12)

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