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Volumn , Issue , 2006, Pages 269-275

Accuracy and application of physics-based circuit models for vias

Author keywords

Ground bounce; Parallel plane impedance; Physics based via models; Recessed probe launch

Indexed keywords

GROUND BOUNCE; HIGH-SPEED COMMUNICATION SYSTEMS; PARALLEL PLANES; PHYSICAL PHENOMENA; PHYSICS-BASED CIRCUIT MODELS; PHYSICS-BASED MODELS; PHYSICS-BASED VIA MODELS; RECESSED PROBE LAUNCH;

EID: 84876586562     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (7)

References (10)
  • 1
    • 0015331132 scopus 로고
    • The planar circuit - An approach to microwave integrated circuitry
    • April
    • T. Okoshi, T. Miyodhi. "The Planar Circuit - An Approach to Microwave Integrated Circuitry, " IEEE Trans, on Microwave Theory and Technique, vol. 20. no. 4. pp. 245 - 252, April 1972.
    • (1972) IEEE Trans, on Microwave Theory and Technique , vol.20 , Issue.4 , pp. 245-252
    • Okoshi, T.1    Miyodhi, T.2
  • 5
    • 0033360282 scopus 로고    scopus 로고
    • Modeling of interconnections and isolation within a multilayered ball grid array package
    • September
    • R. Ito, R. W. Jackson, T. Hongsmatip. "Modeling of Interconnections and Isolation within a Multilayered Ball Grid Array Package", IEEE Trans, on Microwave Theory and Techniques, vol. 47, no. 9. pp. 1819-1825. September 1999.
    • (1999) IEEE Trans, on Microwave Theory and Techniques , vol.47 , Issue.9 , pp. 1819-1825
    • Ito, R.1    Jackson, R.W.2    Hongsmatip, T.3
  • 7
    • 84866404184 scopus 로고    scopus 로고
    • Developing a physical model for vias
    • Santa Clara, CA, USA. February
    • C. Schuster, Y. Kwark, G. Selli, P. Muthana. "Developing a Physical Model for Vias", IEC DesignCon, Santa Clara, CA, USA. February 2006.
    • (2006) IEC DesignCon
    • Schuster, C.1    Kwark, Y.2    Selli, G.3    Muthana, P.4
  • 8
    • 34047223544 scopus 로고    scopus 로고
    • Model-to-hardware correlation of physics based via models with the parallel plate impedance included
    • accepted for presentation at the, Portland, OR. USA. August
    • G. Selli, C. Schuster, Y. Kwark, J. Drewniak, "Model-to-Hardware Correlation of Physics Based Via Models With the Parallel Plate Impedance Included", accepted for presentation at the IEEE Symposium on Electromagnetic Compatibility (.EMCS), Portland, OR. USA. August 2006.
    • (2006) IEEE Symposium on Electromagnetic Compatibility (EMCS)
    • Selli, G.1    Schuster, C.2    Kwark, Y.3    Drewniak, J.4
  • 9
    • 34047239114 scopus 로고    scopus 로고
    • The recessed probe launch - A new signal launch for high frequency characterization of board level packaging
    • Santa Clara, CA, February
    • Y. Kwark, C. Schuster, L. Shan, C. Baks, J. Trewhella, "The Recessed Probe Launch - A New Signal Launch for High Frequency Characterization of Board Level Packaging", IEC DesignCon, Santa Clara, CA, February 2005.
    • (2005) IEC DesignCon
    • Kwark, Y.1    Schuster, C.2    Shan, L.3    Baks, C.4    Trewhella, J.5
  • 10
    • 84876531565 scopus 로고    scopus 로고
    • HFSS™, Version 10. Ansoft Corporation, Pittsburgh. PA. 2006
    • HFSS™, Version 10. Ansoft Corporation, Pittsburgh. PA. 2006.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.