Modeling of interconnections and isolation within a multilayered ball grid array package

IEEE Transactions on Microwave Theory and Techniques

Volumn 47, Issue 9 PART 2, 1999, Pages 1819-1825

  Ito, Ryosuke ^a   Jackson, Robert W ^a  

^a University of Massachusetts   (United States)

Author keywords

BGA; Electrical isolation; Microwave packaging; Multichip module; Package isolation; Package model

Indexed keywords

ELECTRIC ISOLATION; MULTILAYERED BALL GRID ARRAY (BGA) PACKAGES; PACKAGE ISOLATION;

ELECTRONICS PACKAGING; INTERCONNECTION NETWORKS; LUMPED PARAMETER NETWORKS; MATHEMATICAL MODELS; MULTICHIP MODULES; MULTILAYERS;

MICROWAVE INTEGRATED CIRCUITS;

EID: 0033360282     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/22.788517     Document Type: Article

References (10)

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