A semi-analytical approach for system-level electrical modeling of electronic packages with large number of vias

IEEE Transactions on Advanced Packaging

Volumn 31, Issue 2, 2008, Pages 267-274

  Oo, Zaw Zaw ^a   Liu, En Xiao ^b   Li, Er Ping ^a   Wei, Xingchang ^b   Zhang, Yaojiang ^c   Tan, Mark ^b   Li, Le Wei Joshua ^a   Vahldieck, Rüdiger ^d  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b INSTITUTE OF HIGH PERFORMANCE COMPUTING   (Singapore)

^c MISSOURI UNIVERSITY OF SCIENCE AND TECHNOLOGY   (United States)

^d ETH ZURICH   (Switzerland)

Author keywords

Electronic package; Modal expansion; Power integrity; Signal integrity; System level modeling

Indexed keywords

CAPACITANCE; COMPUTER SIMULATION; ELECTROMAGNETIC FIELDS; EQUIVALENT CIRCUITS; INDUCTANCE; MATRIX ALGEBRA; METHOD OF MOMENTS;

MULTIPORT NETWORK PARAMETERS; POWER INTEGRITY; RESISTANCE, INDUCTANCE, CAPACITANCE, AND CONDUCTANCE (RLCG) PARAMETERS; SIGNAL INTEGRITY; SYSTEM-LEVEL MODELING;

ELECTRONICS PACKAGING;

EID: 44449117524     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2008.923379     Document Type: Article

References (18)

1. in In. Technol. Roadmap For Semicond. (ITRS), 2006 [Online]. Available: http://www.itrs.net
2. Y. Chen, Z. Chen, Z. Wu, D. Xue, and J. Fang, "A new approach to signal integrity anaiysis of high-speed packaging," in Proc. IEEE Tropical Meeting Electr. Performance Electron. Parkag., 1995, pp. 235-2388.
3. I. Ndip, W. John, and H. Reichl, "Effects of discontinuities and technological fluctuations on the RF performance of BGA package," in Proc. 55th Electron. Compon. Technol. Conf., 2005, pp. 1769-1775.
4. E.-X. Liu, E.-P. Li, and L.-W. Li, "Analysis of multilayer planar circuits by a hybrid method," IEEE Microw. Wireless Compon. Lett. vol. 16, no. 2, pp. 66-68, Feb. 2006.
5. R. Mandrekar, K. Bharath, K. Srinivasan, E. Engin, and M. Swaminathan, "System level signal and power integrity analysis methodology for system-in-package applications," in Proc. 43rd Design Autom. Conf. Jul. 2006, pp. 1009-1012.
6. J. Park, H. Kim, Y. Jeong, J. Kim, J. S. Pak, D. G. Kam, and J. Kim, "Modeling and measurement of simultaneous switching noise coupling through signal via transition," IEEE Trans. Adv. Packag., vol. 29, no. 3, pp. 548-559, Aug. 2006.
7. H. Chen, Q, Li, L. Tsang, C.-C. Huang, and V. Jandhyala, "Analysis of a large number or vias and differential signaling in multilayered structures," IEEE Trans. Microw. Theory Tech., vol. 51, no. 1, pp. 818-829, Mar. 2003.
8. C. Wei, R. F. Barrington, J. R. Mautz, and T. K. Sarkar, "Multiconductor transmission lines in multilayered dielectric media," IEEE Trans. Microw. Theory Tech., vol. MTT-32, no. 4, pp. 439-450, Apr. 1984.
9. M. B. Bazdar, A. R. Djordjevic, R. F. Harrington, and T. K. Sarkar, "Evaluation of quasi-static matrix parameters for multiconductor transmission lines using Galerkin's method," IEEE Trans. Microw. Theory Tech., vol. 42, no. 7, pp. 1223-1228, Jul. 1994.
10. T. Wang, R. F. Harington, and J. R. Mautz, "Quasi-static analysis of a microstrip via through a hole in a ground plane," IEEE Trans. Microw. Theory Tech., vol. 36, no. 6, pp. 1008-1013, Jun. 1988.
11. E.-P. Li, E.-X. Liu, L.-W. Li, and M.-S. Leong, "A coupled efficient and systematic full-wave time-domain in macromodeling and circuit simulation method for signal integrity analysis of high-speed interconnects," IEEE Trans. Adv. Packag., vol. 27, no. 1, pp. 213-223, Feb. 2004.
12. E.-X. Liu, E.-P. Li, L.-W. Li, and Z. Shen, "Finite-difference time-domain macromodel for simulation of electromagnetic interference at high-speed interconnects" IEEE Trans. Magn., vol. 41, no. 1, pp. 65-71, Jan. 2005.
13. D. Felbacq, G, Tayeb, and D. Maystre, "Scattering by a random set of parallel cylinders," J. Opt. Soc. Am., Opt. Image Sci., vol. 11, pp. 2526-2538, Sep. 1994.
14. L. Tsang, J. A. Kong, K. H. Ding, and C. Ao, Scattering of Electromagnetic Waves: Numerical Simulations. New York: Wiley, 2001.
15. A. C. Balanis, Advanced Engineering Electromagnetics. New York: Wiley, 1989.
16. M. Abramovitz and I. Stegun, Handbook of Mathematical Functions. New York: Dover, 1970
17. E.-X. Liu, X. C. Wei, Z. Z. Oo, and E.-P. Li, "Modeling of advanced multilayered packages with multiple via and finite ground planes," in Proc. 16th Conf. Electr. Performance Electron. Packag., Atlanta, GA, Oct. 2007.
18. F. Jun, J. L. Drewniak, J. L. Knighten, N. W. Smith, A. Orlandi, T. P. Van Doren, T. H. Hubing, and R. E. DuBroff, "Quantifying SMT decoupling capacitor placement in DC power-bus design for multilayer PCBs," IEEE Trans. Electromagn. Compat., vol. 43, pp. 588-599, Nov. 2001.