Analysis of resonance characteristics of a power bus with rectangle and triangle elements in multilayer PCBs

Proceedings - Asia-Pacific Conference on Environmental Electromagnetics, CEEM 2003

Volumn , Issue , 2003, Pages 73-76

  Wang, Zhi Liang ^a   Wada, O ^a   Toyota, Y ^a   Koga, R ^a  

^a OKAYAMA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BUSES; PRINTED CIRCUITS; RESONANCE;

FAST ALGORITHMS; MEASURED RESULTS; MULTI-LAYER PCBS; POWER BUS; POWER BUS RESONANCE; PRINTED CIRCUIT BOARDS (PCB); RESONANCE CHARACTERISTIC; SEGMENTATION METHODS;

PRINTED CIRCUIT BOARDS;

EID: 84954187239     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/CEEM.2003.238538     Document Type: Conference Paper

References (12)

1. C.-T. Lei, R. W. Techentin, and B. K. Gilbert, "High-frequency characterization of power/ground-plane structures," IEEE Trans. Microwave Theory Tech., Vol.47, pp.562-569, May 1999.
2. H. H. Wu, J. W. Meyer, K. Lee, and A. Barber, "Accurate power supply ground plane pair models," IEEE Trans. Advanced Packag., Vol.22, pp.259-266, Aug. 1999.
3. B. Archambeault and A. Ruehli, "Electrical package modeling including voltage and ground reference planes using the partial element equivalent circuit (PEEC) method," Proc. 13th Int. Zurich Symp. and Technical Exhibition on Electromagnetic Compatibility, Zurich, Feb. 1999.
4. J. Fan, J. L. Drewniak, H. Shi, and J. L. Knighten, "DC power-bus modeling and design with a mixed-potential integral-equation formulation and circuit extraction," IEEE Trans. Electromagn. Compat., Vol.43, pp.426-436, Nov. 2001.
5. X. Ye, M. Y. Koledintseva, M. Li, and J. L. Drewniak, "DC power-bus design using FDTD modeling with dispersive media and surface mount technology components," IEEE Trans. Electromagn. Compat., Vol.43, pp.579-587, Nov. 2001.
6. Z. L. Wang, O. Wada, Y. Toyota, and R. Koga, "An improved closed-form expression for accurate and rapid calculation of power/ground plane impedance of multilayer PCBs," Proceedings of Symposium on Electromagnetic Theory, EMT-00-68, Toyama, Japan, Oct. 2000.
7. Z. L. Wang, O. Wada, Y. Toyota, and R. Koga, "Reducing Q-factors of resonances in power/ground planes of multilayer PCBs by using resistive metallic layers," Trans. IEE Japan, Vol. 121-A, No.10, pp.928-932, Oct. 2001.
8. Z. L. Wang, O. Wada, Y. Toyota, and R. Koga, "Application of segmentation method to analysis of power/ground plane resonance in multilayer PCBs," Proc. 3rd Int. Symposium on Electromagnetic Compatibility, pp. 775-778, Beijing, China, May 2002.
9. T. Okoshi, Y. Uehara, and T. Takeuchi, "The segmentation method - An approach to the analysis of microwave planar circuits," IEEE Trans. Microwave Theory Tech., Vol.24, pp.662-668, Oct. 1976.
10. R. Chadha and K. C. Gupta, "Segmentation method using impedance matrices for analysis of planar microwave circuits," IEEE Trans. Microwave Theory Tech., Vol.29, pp.71-74, Jan. 1981.
11. R. Sorrentino, "Planar circuits, waveguide models, and segmentation method," IEEE Trans. Microwave Theory Tech., Vol.33, pp.1057-1066, Oct. 1985.
12. J. Helszajn, Green's Function, Finite Elements and Microwave Planar Circuits, New York, John Wiley & Sons, 1996.